The range of high-performance, power-efficient embedded computing modules has never been broader, making it more difficult for developers to find the best fit.

New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.

Himax Technologies is showcasing new ultralow power AI endpoint solutions and automotive display ICs at Embedded World 2026.

Earlier this month, Microchip Technology released its BZPACK mSiC power modules, engineered to exceed stringent HV-H3TRB ...

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN DIEGO, CA, UNITED STATES, January 9, 2026 ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has begun shipping low-current 3.3kV/400A and 3.3kV/200A versions of a Schottky barrier diode (SBD) ...

TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...

Computer-on-modules (COMs), or system-on-modules (SOMs), were on full display at embedded world in Nuremberg, June 21–23. COMs, SOMs, or server-on-modules are complete embedded computers on one ...

• hardware and software development environments with reference projects. They also offer the opportunity to update their firmware over-the-air and to manage a their energy-saving modes. Cinterion ...

The MXM embedded GPU modules from ADLINK Technology are MXM 3.1 Type A and Type B accelerator modules based on NVIDIA RTX ...